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Home >> Grypper >> Compression Mount Sockets >> "Z" Actuated 1/2 turn LID

Socket Lid Options

"Z" Actuated 1/2 turn LID

New family of LID with an easy turn positive stop

Technical Documents

HSIO 1/2 Turn LID Family








z-lid-zoom z-lid-al

Turn the knob 1/2 turn from Test to Open position. The knob has a positive stop at each end.

 



 

Bolt-On Lids

Available in Multiple Cost-Effective Configurations.

This lid is cost-effective for applications requiring minimal cycling. Options include with/without spring-loaded press and heat sinks. Multiple configurations exist, consult factory for application specific configurations.











 



 

Clip-On Lids

Ideal for Low-Volume Testing, Test Program Development & Bench Testing.

This simple and cost-effective lid is ideal for low-volume testing, test program development and bench testing. Standard features include a spring-loaded press to compensate for typical IC package thickness variation and center thermal-stream access hole and air relief channels for reduced time to temperature. Low-profile design for probe and thermal solution accessibility.







 



 

Integrated Clamshell Lids

A Simpler Approach to Engineering Bench Testing.

Integrated in the test socket body, these lids deliver a simpler approach to engineering bench testing. Standard features include a spring-loaded device press to compensate for typical IC package thickness variation and center thermal-stream access hole and air relief channels for reduced time to temperature. Low-profile design for probe and thermal solution accessibility.







 



 

Removable Clamshell Lids

Easy-to-use Solution for Repetitive Cycling.

Popular for manual test applications, these lids provide an easy-to-use solution for repetitive cycling and are removable to allow usage in an automated IC handler.











 



 

CAM Lids

Heat Sinks with / without Fans, Peltier & Water Cooling

Ideal for manual test and repetitive testing, the spring-loaded design compensates for typical IC package thickness variation with simple operation.

Vertical actuation prevents angular presentation of press to IC package, avoiding lead damage. Options include heat sinks with/without fans, Peltier and water cooling.







 

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