Press Releases

Package Converter Technology allows use of SMT devices on through hole PCB SOT23 package Power MOSFET can be installed in boards made for TO-205AF packaged MOSFET footprint, saving the cost and time of re-spinning the PCB

June 2022

Ironwood Electronics' new adapter for the 3 pin TO-205AF packaged MOSFET device allow use of the equivalent product in SOIC package to be used in PCB boards developed for TO packages. The PC-SOT23-TO39-01 is mapped specifically for the Microchip's N-Channel

40 GHz Bandwidth Socket for BGA121 Package Socket your BGA package using elastomer socket with superior electrical performance

June 2022

Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.5mm pitch BGA package. The CG25-BGA-2002 socket is designed for a 6mmx6mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion

Stamped Spring Pin Socket for BGA289 Socket your BGA289 using Extreme Temperature Socket with Superior Electrical Performance

May 2022

Ironwood Electronics recently introduced a new socket addressing high performance requirements for testing BGA289 – SBT-BGA-6577. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of

Elastomer Socket for High Bandwidth 0.508mm Pitch 132QFP Socket your High Speed QFP IC using elastomer socket with superior electrical performance

May 2022

Ironwood Electronics has recently introduced a new high performance QFP socket for 0.508mm pitch 132 pin QFP. The SG-QFE-7025 socket is designed for 19.39mm x 19.39mm x 4.22mm package size with 24.79mmx24.79mm lead tip to tip and operates at bandwidths

94GHz BGA Socket for Xilinx’s FFVB676 Quickly and easily Socket your 1mm pitch 26x26 array, BGA676 packages on any application board with performance equivalent to direct solder version

April 2022

Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 94GHz, very low inductance and wide temperature applications. The GT-BGA-2175 socket is designed for 27x27 mm package size and operates at bandwidths up to 94GHz

Press Releases

Package Converter Technology allows use of SMT devices on through hole PCB SOT23 package Power MOSFET can be installed in boards made for TO-205AF packaged MOSFET footprint, saving the cost and time of re-spinning the PCB

40 GHz Bandwidth Socket for BGA121 Package Socket your BGA package using elastomer socket with superior electrical performance

Stamped Spring Pin Socket for BGA289 Socket your BGA289 using Extreme Temperature Socket with Superior Electrical Performance

Elastomer Socket for High Bandwidth 0.508mm Pitch 132QFP Socket your High Speed QFP IC using elastomer socket with superior electrical performance

94GHz BGA Socket for Xilinx’s FFVB676 Quickly and easily Socket your 1mm pitch 26x26 array, BGA676 packages on any application board with performance equivalent to direct solder version

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