Press Releases

Tiny Footprint RoHS SMT Package Emulation for 132 Pin, 0.5mm pitch dual row MLF/QFN IC’s Users Can Connect to 0.5mm Pitch QFN/MLF Pads with no extra PCB space using patented SMT emulator foot

June 2014

Ironwood Electronics is introducing the SF-QFN132A-A-01 small footprint Surface Mount Package Emulator Foot for 0.5 mm pitch dual row QFN devices. This device uses patented technology to achieve a reliable and small SMT QFN/MLF adapter. The SF-QFN132A-A-01 has pads on

Probing Adapter for 0.5mm Pitch BGA133 Full Speed Debugging of 0.5mm pitch BGA133 is made easier with PB-BGA133A-Z-01 Socket Probe Adapter with chip size SMT base

May 2014

Ironwood Electronics' PB-BGA133A-Z-01 Socket Probe Adapter which allows high-speed testing of BGA device while accessing the signals using testers via header pins. Ironwood Electronics is an expert in developing high-speed interfaces for processors, peripheral IC's and memory devices and is

40 GHz Bandwidth Swivel Lid Socket for QFN78 Quickly and easily Socket your 13x19mm, mixed pitch QFN packages on any application board with performance equivalent to direct solder version

April 2014

Ironwood Electronics has recently introduced a new QFN socket design using high performance elastomer capable of 40 GHz, very low inductance, high endurance and wide temperature applications. The SM-QFN-9019 socket is designed for 13x19 mm package size and operates at

Clamshell Spring Pin BGA Socket for ASE’s 36 Balls FCCSP Socket your 36 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

March 2014

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing BGA devices - CBT-BGA-7501. The contactor is a stamped spring pin with 14.3 gram actuation force per ball and cycle life of 125,000 insertions. The self

Chip Size 0.5mm Pitch BGA Socket Adapter for Toshiba’s e-MMC Users can socket their 153 pin 0.5mm pitch THGBM5G6A2JBAIR 8GB IC's with socket whose footprint same as IC footprint

February 2014

Ironwood Electronics' new high performance socket - SFS-BGA153B-52 allows 0.5mm pitch, 11.5x13mm body, 14X14 array e-MMC module product housed in 153 ball BGA package to be placed in socket and operated without compromising performance in memory applications. The Giga-snaP™ BGA

Press Releases

Tiny Footprint RoHS SMT Package Emulation for 132 Pin, 0.5mm pitch dual row MLF/QFN IC’s Users Can Connect to 0.5mm Pitch QFN/MLF Pads with no extra PCB space using patented SMT emulator foot

Probing Adapter for 0.5mm Pitch BGA133 Full Speed Debugging of 0.5mm pitch BGA133 is made easier with PB-BGA133A-Z-01 Socket Probe Adapter with chip size SMT base

40 GHz Bandwidth Swivel Lid Socket for QFN78 Quickly and easily Socket your 13x19mm, mixed pitch QFN packages on any application board with performance equivalent to direct solder version

Clamshell Spring Pin BGA Socket for ASE’s 36 Balls FCCSP Socket your 36 pin BGA using Extreme Temperature Socket with Superior Electrical Performance

Chip Size 0.5mm Pitch BGA Socket Adapter for Toshiba’s e-MMC Users can socket their 153 pin 0.5mm pitch THGBM5G6A2JBAIR 8GB IC's with socket whose footprint same as IC footprint

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