Press Releases

Breakout Test Board for 0.5mm Pitch Flex module High Frequency testing of 0.5mm pitch 300 pad flex module is made easier with PB-FLEX300-Z-01 Socket Probe Adapter with FPC connectors

December 2015

Ironwood Electronics' PB-FLEX300-Z-01 Socket Probe Adapter which allows high-speed testing of flex module while accessing the signals using testers via FPC connector. Ironwood Electronics is an expert in developing high-speed interfaces for processors, peripheral IC's and memory devices and is

Production test Socket for BGA30 Socket and Test your 11.2x4.725mm BGA device using extreme temperature socket

November 2015

Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA30 - CBT-BGA-7027. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the

Spring Pin BGA Socket for Sensor Controller Flex Socket your 18 lead Flex using Extreme Temperature Socket with Superior Electrical Performance

November 2015

Ironwood Electronics recently introduced a new Flex socket with zero insertion force addressing high performance requirements for testing Flex devices - SBT-FLEX-7000. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of

Chip Size, SMD Socket Adapter for 84 ball FBGA, 0.8mm Pitch DDR2 SDRAM Users can socket their 84 ball FBGA IC's using zero keep out socket adapter

October 2015

Ironwood Electronics' new high performance SMD Socket Adapter, LS-BGA84H-61, allows user to socket a BGA chip having only the SMT pads on the target PCB without any additional space for a socket. The companion SF-BGA84H-B-64 is attached directly to the

40 GHz Bandwidth Socket for WLCSP54 Package Socket your wafer level chip scale package using elastomer socket with superior electrical performance

October 2015

Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.35mm pitch WLCSP package. The SG25-BGA-2016 socket is designed for a 2.76mmx2.76mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion

Press Releases

Breakout Test Board for 0.5mm Pitch Flex module High Frequency testing of 0.5mm pitch 300 pad flex module is made easier with PB-FLEX300-Z-01 Socket Probe Adapter with FPC connectors

Production test Socket for BGA30 Socket and Test your 11.2x4.725mm BGA device using extreme temperature socket

Spring Pin BGA Socket for Sensor Controller Flex Socket your 18 lead Flex using Extreme Temperature Socket with Superior Electrical Performance

Chip Size, SMD Socket Adapter for 84 ball FBGA, 0.8mm Pitch DDR2 SDRAM Users can socket their 84 ball FBGA IC's using zero keep out socket adapter

40 GHz Bandwidth Socket for WLCSP54 Package Socket your wafer level chip scale package using elastomer socket with superior electrical performance

Login Form