Press Releases

Chip Size 0.65mm Pitch BGA Socket Adapter for DDR4 Users can socket their 200 pin 0.65mm pitch BGA with socket whose footprint same as IC footprint

March 2016

Ironwood Electronics' new high performance socket - SFS-BGA200B-52 allows 0.65mm pitch, 11x14.5mm body, 12X22 array 200 ball BGA package to be placed in socket and operated without compromising performance in high speed applications. The Giga-snaP™ BGA socket adapter pair consists of SFS-BGA200B-52,

40 GHz Bandwidth ATE Socket for BGA240 Quickly and easily Socket your 0.4mm pitch BGA packages on any application board with performance equivalent to direct solder version

February 2016

Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 40 GHz, very low inductance, high endurance and wide temperature applications. The SMP-BGA-8007 socket is designed for 6.064x6.464 mm package size and operates at

Clamshell Socket for 1mm Pitch Xilinx FF2104 Socket your 2104 pin BGA packages with low force lever actuation and high speed elastomer

January 2016

Ironwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch BGA 2104 pin Xilinx IC. The CG-BGA-4022 socket is designed for 47.5X47.5mm package size and operates at bandwidths up to 27 GHz with less than 1dB

Breakout Test Board for 0.5mm Pitch Flex module High Frequency testing of 0.5mm pitch 300 pad flex module is made easier with PB-FLEX300-Z-01 Socket Probe Adapter with FPC connectors

December 2015

Ironwood Electronics' PB-FLEX300-Z-01 Socket Probe Adapter which allows high-speed testing of flex module while accessing the signals using testers via FPC connector. Ironwood Electronics is an expert in developing high-speed interfaces for processors, peripheral IC's and memory devices and is

Production test Socket for BGA30 Socket and Test your 11.2x4.725mm BGA device using extreme temperature socket

November 2015

Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA30 - CBT-BGA-7027. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the

Press Releases

Chip Size 0.65mm Pitch BGA Socket Adapter for DDR4 Users can socket their 200 pin 0.65mm pitch BGA with socket whose footprint same as IC footprint

40 GHz Bandwidth ATE Socket for BGA240 Quickly and easily Socket your 0.4mm pitch BGA packages on any application board with performance equivalent to direct solder version

Clamshell Socket for 1mm Pitch Xilinx FF2104 Socket your 2104 pin BGA packages with low force lever actuation and high speed elastomer

Breakout Test Board for 0.5mm Pitch Flex module High Frequency testing of 0.5mm pitch 300 pad flex module is made easier with PB-FLEX300-Z-01 Socket Probe Adapter with FPC connectors

Production test Socket for BGA30 Socket and Test your 11.2x4.725mm BGA device using extreme temperature socket

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