Press Releases

Production test Socket for eMMC Socket and Test your 11.5x13mm BGA device using extreme temperature socket

April 2016

Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA153 - CBT-BGA-7037. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the

Package Converter Technology allows use of SMT devices on through hole PCB SOIC package can be installed in boards made for DIP devices, saving the cost and time of respinning the PCB

April 2016

Ironwood Electronics' new adapter for the 14 pin DIP device allow use of the equivalent IC in SOIC package to be used in PCB boards developed for DIP packages. The PC-SOIC/DIP14-06 is mapped specifically for the Texas Instruments Linear Comparator

Lever Actuated Stamped Spring Pin Socket for PCBA module Socket your LGA416 using Extreme Temperature Socket with Superior Electrical Performance

March 2016

Ironwood Electronics recently introduced a new LGA socket addressing high performance requirements for 1.2mm pitch devices - CBT-LGA-5012. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 500,000 insertions. The self

Chip Size 0.65mm Pitch BGA Socket Adapter for DDR4 Users can socket their 200 pin 0.65mm pitch BGA with socket whose footprint same as IC footprint

March 2016

Ironwood Electronics' new high performance socket - SFS-BGA200B-52 allows 0.65mm pitch, 11x14.5mm body, 12X22 array 200 ball BGA package to be placed in socket and operated without compromising performance in high speed applications. The Giga-snaP™ BGA socket adapter pair consists of SFS-BGA200B-52,

40 GHz Bandwidth ATE Socket for BGA240 Quickly and easily Socket your 0.4mm pitch BGA packages on any application board with performance equivalent to direct solder version

February 2016

Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 40 GHz, very low inductance, high endurance and wide temperature applications. The SMP-BGA-8007 socket is designed for 6.064x6.464 mm package size and operates at

Press Releases

Production test Socket for eMMC Socket and Test your 11.5x13mm BGA device using extreme temperature socket

Package Converter Technology allows use of SMT devices on through hole PCB SOIC package can be installed in boards made for DIP devices, saving the cost and time of respinning the PCB

Lever Actuated Stamped Spring Pin Socket for PCBA module Socket your LGA416 using Extreme Temperature Socket with Superior Electrical Performance

Chip Size 0.65mm Pitch BGA Socket Adapter for DDR4 Users can socket their 200 pin 0.65mm pitch BGA with socket whose footprint same as IC footprint

40 GHz Bandwidth ATE Socket for BGA240 Quickly and easily Socket your 0.4mm pitch BGA packages on any application board with performance equivalent to direct solder version

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