Press Releases

Package Converter Technology converts QFN Device to BGA Footprint QFN package can be installed in boards made for BGA devices, saving the cost and time of respinning the PCB

March 2017

Ironwood Electronics' new adapter for the 16 pin BGA device allow use of the equivalent IC in QFN package to be used in PCB boards developed for BGA packages. The PC-QFN16A/BGA16C-01 is mapped specifically for the On Semiconductor multi-function differential

Stamped Spring Pin Socket for 3mm pitch SOIC Module Socket your SOIC24 using Extreme Temperature Socket with Superior Electrical Performance

March 2017

Ironwood Electronics recently introduced a new socket addressing high performance requirements for Burn-in and Test applications - SBT-SOIC-2000. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self

Production test Socket for Leaded Ceramic Device Socket and Test your 64 lead Flat pack device using extreme temperature socket

February 2017

Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing 64 lead flat pack - CBT-QFE-3011. The device is to operate at frequencies up to 3.2 GHz, accounting for some harmonics that could be higher frequency.

27 GHz Bandwidth Open Top Socket for BGA121 Quickly and easily Socket your 12mm square, 1mm pitch BGA121 packages on any PCB without significant performance loss

February 2017

Ironwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch, 121 pin BGA IC's. The SG-BGA-6457 socket is designed for IC size - 12x12mm package size and operates at bandwidths up to 27 GHz with less

Chip Size 1.27mm Pitch Socket Adapter for BGA452 Users can socket their 452 ball 1.27mm pitch IC's with socket whose footprint same as IC footprint

January 2017

Ironwood Electronics' new high performance socket adapter - SF-BGA452A-B-32F allows 1.27mm pitch, 35x35mm body, 26X26 array IC to be placed in socket and operated without compromising electrical performance. The Giga-snaP™ BGA socket adapter pair consists of SF-BGA452A-B-32F, patented female BGA sockets with

Press Releases

Package Converter Technology converts QFN Device to BGA Footprint QFN package can be installed in boards made for BGA devices, saving the cost and time of respinning the PCB

Stamped Spring Pin Socket for 3mm pitch SOIC Module Socket your SOIC24 using Extreme Temperature Socket with Superior Electrical Performance

Production test Socket for Leaded Ceramic Device Socket and Test your 64 lead Flat pack device using extreme temperature socket

27 GHz Bandwidth Open Top Socket for BGA121 Quickly and easily Socket your 12mm square, 1mm pitch BGA121 packages on any PCB without significant performance loss

Chip Size 1.27mm Pitch Socket Adapter for BGA452 Users can socket their 452 ball 1.27mm pitch IC's with socket whose footprint same as IC footprint

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