Press Releases

Ironwood Electronics Assumes Control of HSIO Grypper Socket Line HSIO Technologies and Ironwood Electronics are pleased to announce that exciting Technology Licensing and Operations agreements have been executed between the two Companies to support the Semiconductor Test

September 2019

HSIO Technologies and Ironwood Electronics are pleased to announce that exciting Technology Licensing and Operations agreements have been executed between the two Companies to support the Semiconductor Test Socket marketplace. In the first phase of what is expected to be

Clamshell Socket for 1mm Pitch Xilinx FF896 Socket your 896 pin BGA packages with heat sink assembly and high speed elastomer

August 2019

Ironwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch BGA 896 pin Xilinx IC. The CG-BGA-4027 socket is designed for 31X31mm package size and operates at bandwidths up to 27 GHz with less than 1dB

40 GHz Bandwidth Socket for BGA190 Package Socket your 190 ball BGA package using elastomer socket with superior electrical performance

August 2019

Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.5mm pitch BGA package. The CG15-BGA-1003 socket is designed for a 10mmx5.7mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion

75GHz BGA Socket for NXP’s BGA388 Quickly and easily Socket your mixed pitch 35x35 array, BGA388 packages on any application board with performance equivalent to direct solder version

July 2019

Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 75GHz, very low inductance and wide temperature applications. The GT-BGA-2105 socket is designed for 15x15 mm package size and operates at bandwidths up to

Signal Integrity simulation of socket contactors using CST MWS Take advantage of the low cost SI simulation offered by Ironwood Electronics

July 2019

Impedance mismatch in contacts in test sockets can affect the signal integrity (SI) performance when testing high-speed semiconductor ICs. This discontinuity is mainly caused by mechanical features in interconnects/contactors that may result in impedance change. The signal integrity analysis of

Press Releases

Ironwood Electronics Assumes Control of HSIO Grypper Socket Line HSIO Technologies and Ironwood Electronics are pleased to announce that exciting Technology Licensing and Operations agreements have been executed between the two Companies to support the Semiconductor Test

Clamshell Socket for 1mm Pitch Xilinx FF896 Socket your 896 pin BGA packages with heat sink assembly and high speed elastomer

40 GHz Bandwidth Socket for BGA190 Package Socket your 190 ball BGA package using elastomer socket with superior electrical performance

75GHz BGA Socket for NXP’s BGA388 Quickly and easily Socket your mixed pitch 35x35 array, BGA388 packages on any application board with performance equivalent to direct solder version

Signal Integrity simulation of socket contactors using CST MWS Take advantage of the low cost SI simulation offered by Ironwood Electronics

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