Press Releases

SSD NAND and 3D XPoint Zero Foot Print Test Sockets Device size SMT sockets for all types of NAND applications with Superior Electrical Performance

March 2020

Ironwood Electronics, continues to design and manufacture new innovative SMT Grypper sockets. Ironwood has a complete line of NAND, Controller, and Buffer sockets used in Solid State Drives, Cards and Modules. The Zero Foot Print (Grypper) sockets are available for

30 GHz BGA Socket for BGA625 Socket your 625 pin BGA package 0.65mm pitch without significant performance loss and with minimal increase in PC Board footprint

February 2020

Ironwood Electronics has recently introduced a new high performance BGA socket for 0.65mm pitch BGA 625 pin device. The CG-BGA-5032 socket is designed for 16x16 mm package size and operates at bandwidth up to 30 GHz with less than 1dB

Grypper “Y” Sockets for eMMC and Universal Flash Storage (UFS) devices Socket your BGA153 using the Grypper Y Socket with Superior Electrical Performance

February 2020

Ironwood Electronics, continues to design and manufacture new Grypper Y test sockets for Industry Standard eMMC / Universal Flash Storage (UFS) memory devices. Ironwood Grypper socket, part number 113036-0003, allows testing of the newest generation (UFS) 153 BGA form-factor and

Open top Socket for QFP48 Socket and Test your 48 lead Quad Flat pack device using extreme temperature socket

January 2020

Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing 48 lead Quad flat pack - CBT-QFE-3018. The contactor used in CBT-QFE-3018 socket is a stamped spring pin with 17 gram actuation force per

Zero footprint LPDDR5 Grypper Socket Socket your BGA496 using Grypper Socket same size as device with Superior Electrical Performance

January 2020

Ironwood Electronics, continues to design and manufacture new Grypper/G40 test sockets for the latest releases of memory devices - LPDDR5. Ironwood Grypper socket, part number 109111-0003, allows testing of the newest generation of Package-On-Package type LPDDR5 devices that have 496

Press Releases

SSD NAND and 3D XPoint Zero Foot Print Test Sockets Device size SMT sockets for all types of NAND applications with Superior Electrical Performance

30 GHz BGA Socket for BGA625 Socket your 625 pin BGA package 0.65mm pitch without significant performance loss and with minimal increase in PC Board footprint

Grypper “Y” Sockets for eMMC and Universal Flash Storage (UFS) devices Socket your BGA153 using the Grypper Y Socket with Superior Electrical Performance

Open top Socket for QFP48 Socket and Test your 48 lead Quad Flat pack device using extreme temperature socket

Zero footprint LPDDR5 Grypper Socket Socket your BGA496 using Grypper Socket same size as device with Superior Electrical Performance

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