Press Releases

Lab Test Screw Down Spring Loaded Heatsink with the Key Locked Pin Heatsink is for 23x23mm BGA 1mm pitch socket using GT contact that has 30g force per ball, provide >94 GHz signal speed, cycle life up to 2000 insertions, and operated at -55C to +160C.

June 2024

Production Test Socket for BGA225 with double latch manual actuator Socket and test 24x24mm BGA with 1.27mm pitch using stamped spring pin contact that has 19g force per ball, cycle life of 125000 insertions and operates at -55C to +180C.

May 2024

30GHz Elastomer socket for BGA289 High performance and low inductance gold plated embedded wire in elastomer as interconnect material between device and PCB operates 30GHz at -1dB insertion loss, 0.15nH self-inductance, 0.01pF capacitance with 2A current capacity. Simple swivel lid socket structure enables industry’s smallest footprint.

April 2024

60GHz Spring Pin Socket for CSP64 Shortest spring pin, 1mm compressed height, provides highest electrical bandwidth 60GHz with lowest inductance of 0.17nH along with 2A continuous current carrying capacity. Quarter turn spring loaded lid allows gradual pressure to CSP with easy chip replacement functionality.

March 2024

Socket for Optoelectronic Module Quickly and easily socket your optoelectronic module (BGA64, 0.45mm pitch, 7.7x10mm size) and verify the performance equivalent to direct solder version using a high performance spring pin with low inductance of 0.17nH that operates from -40C to +120C.

February 2024