No, the silver balls do no disintegrated over multiple cycles
XSolder mask is recommended however at a 0.4mm pitch it is better to remove solder mask in the socket area for better connectivity to the silver ball column.
XThe mounting screws should be torqued using the supplied hex key until they are finger tight. The recommended torque for the central compression screw is given on the part drawing.
XSM should be inspected and cleaned when there is debris in the socket
Cleaning instructions are given here:
Assembly Cleaning Instructions
The SM elastomer has more force per ball than the SG elastomer, the 5 post backing plate doesn’t provide enough support.
XUse the recommended torque, there is an over compression stop built in, however it can still be damaged if you try hard enough.
XAn IC frame is needed if your chip has a mold cap
X0.2mm, standard BGA co-planarity
XYes. After 1 HTOL cycle, SM needs to be replaced.
XThermal resistance of SM elastomer is 3 deg C/Watt
X