Grypper G35 / G40

High-performance, 0.35mm-0.5mm pitch net zero package footprint engineering test sockets for BGA style packaged devices

Grypper

High-performance, 0.65 mm + pitch net zero package footprint engineering test sockets for BGA style packaged devices

Grypper G80 / G80 LIF

High-performance, 0.65 mm+ pitch net zero package footprint engineering test sockets for BGA style packaged devices over 200 ball count and for over 300 the G80 LIF to reduce insertion forces

Near Zero Footprint SMT Spring Pin Sockets

High performance, higher insertion count – with sliding lid and other options, surface mountable near zero footprint sockets for 0.35mm+ pitch devices (BGA, LGA, QFN, etc.)

Grypper "Y"

High performance, medium insertion count – with sliding lid, surface mountable near zero footprint sockets for 0.35mm+ pitch BGA devices

Near Zero Footprint SMT Elastomer Sockets (GR)

High performance higher insertion count  - with screw down lid and other options, surface mountable near zero footprint sockets for 0.35mm+ pitch devices (BGA, LGA, QFN, etc.)

DDR

Zero Footprint - No Lid Required - S21 Electrical Performance >40 GHz

eMMC

Zero Footprint - No Lid Required - S21 Electrical Performance >40 GHz

LPDDR

Zero Footprint - No Lid Required - S21 Electrical Performance >40 GHz

ONFi

NAND/ONFi Zero Footprint - No Lid Required - S21 Electrical Performance >40 GHz