Circular opening is suffice. We have optimized hole geometry based on pin outer dimension to avoid any pin bending. We have made 1000s of sockets using circular hole design.
XSolder mask is not necessary for SBT style socket. But solder mask is preferred to avoid any accidental shorts. Copper defined pad is better for SBT contact.
XThe mounting screws should be torqued using the supplied hex key until they are finger tight. The central compression screw need to be tightened such that it comes to a hard stop.
XAnytime when the socket is removed from PCB, the target pads has to be cleaned. SBT pin tips need cleaning based application and solder accumulation on the tip.
Assembly Cleaning Instructions
Depending on the target PCB thickness and BGA pin count we may or may be able to use 5 post backing plate.
XThe Pin guides are designed to eliminate over compression on the pins.
XIf the IC top surface has mold projections or components, then we need to place an IC frame that goes around components or mold projection. This makes the top surface flat which is necessary for applying uniform pressure throughout IC top surface.
XFor 0.5mm and 0.4mm we recommend to you use 0.1mm co-planarity and for ≥ 0.8mm pitch 0.2mm co-planarity is acceptable.
XYes, SBT pin sockets can be used for HTOL test.
XWe used 400 SBT pins for the experiment. Thermal resistance is 1.5 deg C/Watt.
X