75GHz Clamshell Socket for NXP’s FCPBGA Quickly and easily Socket your 0.8mm pitch interstitial array, 609BGA packages on any application board with performance equivalent to direct solder version

Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 75GHz, very low inductance and wide temperature applications. The GT-BGA-2027 socket is designed for 21×21 mm package size and operates at bandwidths up to 75GHz with less than 1dB of insertion loss. The socket is designed to dissipate few watts using aluminum components and can be customized up to 100 watts by adding central heat sink and axial flow fan. The contact resistance is typically 30 milliohms per pin. The socket is mounted on the target PCB with no soldering, and uses very small real estate allowing capacitors/resistors to be placed close by. Other passive components can be placed on the back side of PCB by creating custom cutouts in the stiffener plate. The socket is constructed with cam actuated lever lid with central opening for direct thermal characterization of silicon. To use, place the device inside the socket, close the clamshell lid by latching and apply downward pressure by turning lever. Lever provides mechanical advantage in applying 67 lbs easily.

The GT-BGA-2027 socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -55 C to +160 C. Works with IC’s such as 609 BGA, 21x21mm with 35×35 interstitial array and 0.8mm pitch.

Pricing for the GT-BGA-2027 is $1066 at qty 1; with reduced pricing available depending on quantity required.