| IC Socket Footprint- Why is it important? |
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| Package Converter Compliments Chip Obsolescence |
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| 3D IC Development Needs Innovative Socket Solution |
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| Enhanced interconnect medium simplifies test & verification |
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| Role of Sockets in IC Product Life Cycle |
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| IC Interconnects for the Life of Your Product |
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| S-Parameter Simulation for Sockets & Adapters |
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| Chip size IC socket solution for BGA and CSP |
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| Methodical Socket Selection Speeds up Time-to-Market for IC Development Projects |
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| Optimizing Insertion Extraction Force in a Pin-Socket Interconnect |
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| BGA Socket Considerations - Prototype to Reality |
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| BGA Socket with Heatsink for High Power Devices |
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| Product Life-Cycle White Paper |
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| GHz Bandwidth Socket White Paper |
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| ISO White Paper |
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| DOE relates spring probe variables to signal integrity |
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