Users can socket their 0.8mm pitch, 332ball BGA/CSP devices without performance loss or little board space, no mounting holes.
BURNSVILLE, MN - May, 2005 - Ironwood Electronics' new high performance Socket - SG-BGA-6156 allow 0.8 mm pitch, 17x17mm body IC's to be used in socket and operate without compromising performance in very high speed computing and communication applications. The sockets easily support very dense BGA devices utilizing a high performance conductive elastomer contactor. The contact resistance is normally 10 milliohms. The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses an aluminum heat sink screw to provide compressive force. The socket has a thermal pad to conduct heat from silicon to the heat sink screw. The socket accommodates IC packages such as the Motorola case 1473-01 package, 0.8 mm pitch BGA, and 19x19 array of balls. The socket requires no mounting holes and requires only 3.75 mm perimeter space for the SMT adaptor to be soldered on the target PCB. The socket can be mechanically mounted on the SMT adaptor.
The SMT adaptor (SF-BGA332A-B-05) consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls and threaded inserts for mounting the socket. These patented ZIF sockets are simply mounted on the SMT adaptor which is soldered to the target PCB.
Pricing for the socket SG-BGA-6156 is $417.00 at quantity 1 and SF-BGA332A-B-05 is $112.00 at quantity 1.
11351 Rupp Dr.
Burnsville, MN 55337
Tel: 952-229-8200 or (800) 404-0204