ZIF Heat-sink Socket for 1 mm pitch ST Micro BGA package without significant performance loss
BURNSVILLE, MN - November, 2007 - Ironwood Electronics has recently introduced the new high performance BGA ZIF sockets for 1.0mm pitch BGA. The SG-BGA-6245, SG-BGA-6246 sockets are designed for a ST Micro 35mm and 27mm package sizes; operate at bandwidths up to 8 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to 4.5 watts @ 40 deg C and can handle up to 100 watts with enhanced heat sink. The contact resistance is typically 23 milliohms per pin. The socket requires only 2.5mm clearance around the chip so discrete components can be placed near the IC. The heat-sink installation is simple and reliable requiring only that the heat-sink be rotated to the proper down force position.
The SG-BGA-6245 and SG-BGA-6246 is constructed with high performance and low inductance elastomer. The temperature range is -35 C to +100 C. The pin inductance is 10.15 nH. Capacitance to ground is 0.10 pF. The SG-BGA-6245 accommodates 35mm BGA body size IC packages with 34X34 array and 1156 balls. The SG-BGA-6246 accommodates 27mm BGA body size IC packages with 26X26 array and 676 balls. Simply attach the socket to the PCB, drop in chip, attach lid, and tighten heat-sink compression screw.
Pricing for the SG-BGA-6245 and SG-BGA-6246 is $1020 and $738 respectively at qty 1 with reduced pricing available depending on quantity required.
11351 Rupp Dr.
Burnsville, MN 55337
Tel: 952-229-8200 or (800) 404-0204