Socket your BGA packages without significant performance loss and with minimal increase in PC Board footprint
BURNSVILLE, MN - June, 2007 - Ironwood Electronics has recently introduced the new high performance BGA socket for 1.0mm pitch BGA. The SG-BGA-8000 socket is designed for a 31mm package size; operate at bandwidths up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 23 milliohms per pin.
The SG-BGA-8000 is constructed with high performance and low inductance elastomer. The temperature range is -35 C to +85 C. The pin inductance is 10.15 nH. Capacitance to ground is 0.10 pF. The socket accommodates IC packages such as the IDT 31x31mm, 1mm pitch FCBGA. Simply attach the socket to the PCB, drop in chip, place easy install swivel lid. This socket technology, applicable for BGA pitches from 0.8 to 1.27mm, allows these pitch BGAs to operate to over 10 GHz without significant contactor loss.
Pricing for the SG-BGA-8000 is $1,361 at qty 1 with reduced pricing available depending on quantity required.
|Part #||IC size mm^2||IC Pitch mm||IC Array||IC name/desc|
|SG-BGA-8001||35x35||1||34x34||IDT 35x35mm 1mm pitch FCBGA|
|SG-BGA-8002||17x17||1||16x16||BGA 17x17mm, 1mm pitch 156L|
|SG-BGA-8003||19x19||1||18x18||BGA 19x19mm, 1mm, 18x18 array|
|SG-BGA-8004||27x27||1||26x26||BGA 27x27mm, 1mm pitch, 26x26|
|SG-BGA-8008||25x25||1||24x24||IBM 25mm CBGA/SCM|
|SG-BGA-8009||31x31||1||30x30||IDT BX/RX 500 31x31mm SBGA|