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High Performance
Sockets & Adapters
1-800-404-0204
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July 2009

High Performance, 10 GHz Socket Technology for 1.0mm Pitch BGA Packages with High Power Dissipation

Socket your BGA packages without significant performance loss and with minimal increase in PC Board footprint

BURNSVILLE, MN - July, 2009 - Ironwood Electronics has recently introduced the new high performance BGA socket for 1.0mm pitch BGA. The SG-BGA-8019 socket is designed for a 35mm package size; operate at bandwidth up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate 16 watts with swivel heat sink lid. The swivel heat sink lid swivels over the shoulder screw which is fixed in the socket body. The contact resistance is typically 20 milliohms per pin.

The SG-BGA-8019 is constructed with high performance and low inductance elastomer. The temperature range is -40 C to +100 C. The pin inductance is 0.15 nH. Capacitance to ground is 0.10 pF. Current capacity is 2A per pin. The socket accommodates IC packages such as the IDT 35x35mm, 1mm pitch FCBGA. Simply attach the socket to the PCB, drop in chip, place and tighten easy install swivel lid with heat sink. This elastomer socket technology, applicable for BGA pitches from 0.3 to 1.27mm, allows these pitch BGA's to operate to over 10 GHz without significant contactor loss.

Pricing for the SG-BGA-8019 is $2178 at qty 1 with reduced pricing available depending on quantity required.

Ranjit Patil
11351 Rupp Dr.
Suite 400
Burnsville, MN 55337

Tel: 952-229-8200 or (800) 404-0204
Fax: 952-229-8201
info@ironwoodelectronics.com
www.ironwoodelectronics.com


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