Users can socket their 324 pin 0.5mm pitch BGA IC's without performance loss with smallest socket footprint
BURNSVILLE, MN - March, 2005 - Ironwood Electronics' new high performance socket - SS-BGA324K-01 allows 0.5mm pitch, 12mm body, 22X22 array IC's to be used in socket and operate without compromising performance in very high bandwidth applications. The new 10 GHz bandwidth sockets (<-3dB at 10 GHz) support the very dense pitch BGA devices in a 500,000 actuations socket. The socket is designed to dissipate up to 7 watts without extra heatsinking and can handle up to 60 wattts with custom heatsink. The contact resistance is typically 80 milliohms per ball.
The SS-BGA324K-01 is constructed with high endurance spring pins (pogo) with endurance rated at 500,000 actuations. The temperature range is -40 C to +150C so it can be used to test the product over burn-in and high temperature test applications. The pin inductance is 1.3nH and the mutual inductance is .15 nH typically. Capacitance to ground is 0.53 pF and pin to pin capacitance is 0.045 pF. The socket footprint requires only a 2.5 mm border around the IC - the smallest available.
Pricing for the SS-BGA324K-01 socket adapter $1,888 each at quantity 1.
11351 Rupp Dr.
Burnsville, MN 55337
Tel: 952-229-8200 or (800) 404-0204