Users can socket their 60 Wat,t 1521ball BGA/ devices without performance loss using very little board space
BURNSVILLE, MN - January, 2005 - Ironwood Electronics' new high performance Socket - SG-BGA-6145 allow 1.0 mm pitch, 40X40 mm body IC's to be used in socket and operate without compromising performance in very high speed computing applications. The new 6.5 GHz bandwidth sockets easily support very dense BGA stacked devices utilizing a high performance conductive elastomer contactor. The socket is designed to dissipate up to 60 Watts in socket with a computer designed aluminum finned heatsink. The contact resistance is normally 10 milliohms. The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses an aluminum heat sink screw to provide compressive force. The socket accommodates IC packages such as the ASE 1117L HFCBGA, 1.0 mm pitch, and arrays with up to 1521 balls. The socket requires mounting holes and only minimal perimeter space for the socket body on the target PCB.
These patented ZIF sockets are simply mechanically mounted to the target PCB. The sockets are only slightly larger than the actual IC packages, minimizing PCB footprint or 2.5mm IC border on system boards while maximizing system speeds.
Pricing for the socket SG-BGA-6145 is $907.00 each at quantity 100.
11351 Rupp Dr.
Burnsville, MN 55337
Tel: 952-229-8200 or (800) 404-0204