Users can socket their 0.75mm pitch, 48ball BGA/CSP devices without performance loss or little board space, no mounting holes, no solder.
BURNSVILLE, MN - August, 2005 - Ironwood Electronics' new high performance Socket - SG-BGA-7064 allow 0.75 mm pitch, 7.286X10.85mm body IC's to be used in socket and operate without compromising performance in very high speed memory applications. The new 10+ GHz bandwidth sockets easily support very dense BGA stacked devices utilizing a high performance conductive elastomer contactor. The contact resistance is normally 10 milliohms. The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses an aluminum heat sink screw to provide compressive force. The socket accommodates IC packages such as the Intel StrataFlash memory VF BGA package, 0.75 mm pitch BGA, and 6x8 array of balls. The socket requires no solder and no mounting holes and requires only 1.25 mm perimeter space for the socket body on the target PCB.
These patented ZIF sockets are simply mounted to the target PCB by an epoxy band around the perimeter. The socket is placed into position with a precision alignment tool and epoxied in place. There are special grooves on the socket wall for additional epoxy strength. The contactor can be easily replaced after hundreds of cycles.
Pricing for the socket SG-BGA-7064 is $342.75 at quantity 100.
11351 Rupp Dr.
Burnsville, MN 55337
Tel: 952-229-8200 or (800) 404-0204