Socket your LGA packages without significant performance loss and with minimal increase in PC Board footprint
BURNSVILLE, MN - March, 2008 - Ironwood Electronics has recently introduced the new high performance LGA socket for 0.65mm pitch LGA devices. The XG-LGA-7000 sockets are designed for a 12mm package size, operates at bandwidths up to 40 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 50 milliohms per pin.
The XG-LGA-7000 is constructed with high performance and low inductance elastomer with a gold plated, barbed pad connecting to the IC Pad. The temperature range is -40 C to +155 C. The pin self inductance is 0.11 nH and mutual inductance of 0.028 nH. Capacitance to ground is 0.028 pF. The socket accommodates IC packages such as the 12X12 LGA with 0.65mm pads in a 17x17 array. Simply attach the socket to the PCB, drop in chip, place lid. Current capacity is 5 amps per pin. In addition the open lid option (XG-LGA-7001) allows probing of die or direct injection of heat or cooling air.
Pricing for the XG-LGA-7000 $1397 at qty 1 with reduced pricing available depending on quantity required.
11351 Rupp Dr.
Burnsville, MN 55337
Tel: 952-229-8200 or (800) 404-0204