Quickly and easily Socket your 1mm pitch, 31x31mm BGA package on any PCB without significant performance loss
EAGAN, MN - December, 2014 - Ironwood Electronics has recently introduced a new high performance BGA socket for Hybrid Memory Cube (1mm pitch, 900 pin BGA). A hybrid memory cube (HMC) is a single package containing either four or eight DRAM die and one logic die, all stacked together using through-silicon via (TSV) technology. The SG-BGA-6412 socket is designed for 31x31mm package size with 30x30 ball array and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 20 milliohms per pin. The socket connects all pins with 8 GHz bandwidth on all connections. The socket is mounted on the target PCB with no soldering, and uses industry's smallest footprint (only 2.5mm more on each side). The socket is constructed with shoulder screw and swivel lid which incorporates a quick insertion method so that IC's can be changed out quickly.
The SG-BGA-6412 socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -35 C to +100 C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 amps per pin. Works with IC's such as Micron's HMC in BGA package with 30x30 array and 1mm pitch.
Pricing for the SG-BGA-6412 is $896 at qty 1; with reduced pricing available depending on quantity required.
1335 Eagandale Court
Eagan, MN 55121
Tel: 952-229-8200 or (800) 404-0204